Ball grid array - Wikipedia
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
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BGA has been awarded this prestigious recognition for the dedication, hard work and continuous innovation from our dedicated staff and strong customer base. We cannot praise them enough for...